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The atmospheric plasma cleaner system consists of three main components:
1. The host is connected to the power supply connection to cool the processing gas high RF voltage plasma source control module gas control module front panel operation control system.
2. Flexible conduits for transporting gases and energy.
3. Plasma nozzle: consists of an intermediate electrode, an external electrode and an insulating region.
● The high voltage RF generator converts the constant voltage to a high voltage (over 10KV), which is necessary to form a high voltage discharge.
? High voltage and cooled process gas is delivered to the discharge area through a flexible conduit.
● The active elements (i+, e-, r*) in the gas stream will create an arc in the discharge area.
? The active gas stream is focused on the surface of the sample as it passes through a special nozzle opening for processing.
● Plasma spray gun (dynamic rotary type); maximum speed: 3000 rpm; processing width: 3-60mm adopts imported special ceramic insulation, permanent breakdown; plasma nozzle and discharge electrode adopt imported alloy material, high temperature resistance, oxidation resistance ,long life.
● Generator power control system Atmospheric plasma cleaning machine >> Brake pad atmospheric plasma cleaning machine
Plasma plasma cleaning machine frequency 16-20KHZ double pulse secondary inverter, power 0-1KW separately adjusted, full circuit protection, 180-250V wide range voltage regulation, output power can be continuously adjusted and preset. LCD voltage and current display, with working status panel indication function, and automatic alarm and prompt.
Atmospheric selling point:
● Power 0-1000W continuously adjustable
● Air pressure 0-1.0Mpa continuously adjustable
● Processing range is available in various specifications
● The working range is preset and the parameters are adjusted in real time.
● Display working status in real time
● The cause of the alarm is displayed when the fault occurs.
● Perfectly matched with automation equipment to work synchronously
[Plasma cleaning machine application and principle]
First, the metal surface is degreased and cleaned
Metal surfaces often have organic substances such as grease and oil, and oxide layers. Before sputtering, painting, bonding, bonding, welding, brazing, and PVD, CVD coating, plasma treatment is required to obtain complete cleanliness and no oxidation. The surface of the layer. Plasma treatment in this case produces the following effects:
1.1 ashing the surface organic layer
- the surface will be chemically bombarded (oxygen below)
- Partial evaporation of contaminants under vacuum and transient high temperatures
- Contaminants are crushed under the impact of high energy ions and carried out by vacuum
- UV radiation destroys pollutants
Because plasma processing can only penetrate a few nanometers per second, the contaminated layer should not be too thick. Fingerprints also apply.
1.2 oxide removal
Metal oxides react chemically with process gases (below)
This treatment requires hydrogen or a mixture of hydrogen and argon. Sometimes a two-step process is also used. The first step is to oxidize the surface with oxygen for 5 minutes. In the second step, the oxide layer is removed with a mixture of hydrogen and argon. It can also be treated with several gases at the same time.
Typically, printed wiring boards are treated with a chemical flux prior to soldering. These chemicals must be removed by plasma after the soldering is completed, otherwise it will cause corrosion and other problems.
Good bonding is often impaired by plating, bonding, and residue during soldering operations, and these residues can be selectively removed by plasma methods. At the same time, the oxide layer is also detrimental to the quality of the bond and plasma cleaning is also required.
Second, plasma etching
During the plasma etching process, the etched material becomes a gas phase by the action of the processing gas (for example, when etching with silicon using fluorine gas, the following figure). The process gas and matrix material are pumped out by a vacuum pump and the surface is continuously covered by fresh process gas. It is not desirable to cover the etched portion with a material (for example, the semiconductor industry uses chromium as a covering material).
The plasma method is also used to etch the surface of the plastic, and the mixture can be ashed by oxygen to obtain a distribution analysis. Etching methods are important as pretreatment means for plastic printing and bonding, such as POM, PPS and PTFE. Plasma treatment can greatly increase the bond wetted area.
Third, etching and ashing
PTFE cannot be printed or bonded without treatment. It is well known that the use of active alkaline metals enhances adhesion, but this method is not easy to grasp and the solution is toxic. Using a plasma method not only protects the environment, but also achieves better results. (The following figure)
The plasma structure maximizes the surface while forming an active layer on the surface so that the plastic can be bonded and printed.
Etching of PTFE mixture
The etching of the PTFE mixture must be carried out very carefully to avoid excessive exposure of the filler, thereby weakening the adhesion.
The process gases can be oxygen, hydrogen and argon. Can be applied to PE, PTFE, TPE, POM, ABS and propylene.
4. Surface activation and cleaning of plastics, glass and ceramics
Plastics, glass, and ceramics are as non-polar as polypropylene and PTFE, so these materials are processed before printing, bonding, and coating. At the same time, slight metal contamination of the glass and ceramic surfaces can also be cleaned by plasma. Plasma treatment does not damage the sample compared to the burning process. At the same time, the entire surface can be treated very evenly without toxic fumes, and hollow and slit samples can be processed.
· No need to pretreat with solvent
· All plastics can be applied
· Environmentally meaningful
· Take up very small work space
· low cost
The effect of the plasma surface treatment can be verified simply by using water, and the surface of the treated sample is completely wetted by water. For long periods of plasma treatment (greater than 15 minutes), the surface of the material is not only activated but also etched, and the etched surface has a wetting ability. Commonly used processing gases are: air, oxygen, argon, argon-hydrogen mixed gas, CF4, etc.
Fifth, plasma coating
In the coating, two gases enter the reaction chamber at the same time, and the gas is aggregated in a plasma environment. This application is more stringent than the requirements for activation and cleaning. Typical applications are the formation of protective layers for fuel containers, scratch-resistant surfaces, PTFE-like coatings, waterproof coatings, and the like. The coating is very thin, usually a few microns, where the affinity of the surface is very good. There are 3 cases commonly used
· Waterproof coating - cycline
· Coating similar to PTFE---fluorine-containing processing gas
· Hydrophilic coating---ethylene acetate
The small plasma cleaner has the advantages of low cost and flexible operation. Compared with large products with a price of more than US$100,000, the small plasma cleaning minicomputer has the following advantages:
1. It can operate more flexibly and easily change the type of processing gas and processing procedure.
2, will not cause any harm to the body of the person.
3. Its cost is negligible for plasma processing methods.
Small plasma equipment is widely used in plasma cleaning and surface modification. Through its treatment, it can improve the wetting ability of materials, enable a variety of materials to be coated, plated, etc., enhance adhesion, bonding force, and remove organic pollutants, oil or grease.
Its specific applications include:
1. Activation of plastic, glass and ceramic surfaces
Glass, ceramics, and plastics (such as polypropylene, PTFE, etc.) are essentially non-polar, so these materials are surface activated prior to bonding, painting, and coating.
2, metal degreasing and cleaning
Metal surfaces often have organic substances such as grease and oil, and oxide layers. Before sputtering, painting, bonding, bonding, welding, brazing, and PVD, CVD coating, plasma treatment is required to obtain complete cleanliness and no oxidation. The surface of the layer.
Before the welding operation: Usually the printed circuit board is treated with chemical flux before soldering. These chemicals must be removed by plasma after the soldering is completed, otherwise it will cause corrosion and other problems.
Before the bonding operation: good bonding is often weakened by residues during plating, bonding, and soldering operations, and these residues can be selectively removed by a plasma method. At the same time, the oxide layer is also detrimental to the quality of the bond and plasma cleaning is also required.
· Easy to operate and low cost
· High efficiency vacuum electrode
· Gas flow through the flow meter and needle valve for precise control
· Power can be adjusted within 200W (completely able to meet cleaning needs, more than 200W for etching)
· Automatic impedance matching
· Free setting parameters: processing time, power, gas, pressure
· Safety protection function: vacuum trigger, door lock
[Plasma cleaner application]
· Conventional cleaning methods do not completely remove the surface film of the material, leaving a very thin layer of impurities, and solvent cleaning is a typical example of this.
· The use of a plasma cleaner is to scrub the surface gently and completely by bombardment of the surface of the material by plasma.
? Plasma cleaning will remove invisible oil film, tiny rust and other such contaminants formed on the surface due to user exposure to outdoor exposure, etc., and plasma cleaning will not leave a residue on the surface.
· Plasma cleaners can handle a wide range of materials: plastics, metals, ceramics, and surfaces with varying geometries.
· The advantage of the plasma cleaner is that it not only cleans the dirt on the surface, but also enhances the adhesion of the surface of the material.
2. Polymer cleaning
1 polymer surface cleaning
· Plasma ablation mechanically removes the dirt layer by high-energy electrons and ions bombarding the surface of the material.
· Plasma surface cleaning removes dirt layers that may be present in certain processed polymers, unwanted polymer surface coatings and weak boundary layers
2 Surface reorganization of the polymer
? The inert gas used in plasma ablation destroys the chemical bonds on the polymer surface leading to the formation of free functional groups on the polymer surface.
? The free functional groups on the surface of the polymer re-bond to form the original polymer structure, also bond to free functional groups adjacent on the same polymer chain, or to free functional groups in the vicinity of different polymer chains.
· Polymer surface reorganization can improve the hardness and chemical resistance of the surface.
3 Surface modification of the polymer
? Plasma ablation destroys the chemical bonds on the polymer surface, resulting in the formation of free functional groups on the polymer surface.
· Based on the chemistry of the plasma process gas, the attachment of these surface free functional groups to the atoms or chemical groups in the plasma forms a new polymer functional group that replaces the old surface polymer functional group.
· Polymer surface modification can change the chemical properties of the material surface without changing the overall properties of the material.
4 polymer surface coating
· Plasma coating forms a thin plasma coating on the surface of the substrate by polymerization of the process gas.
· If the process gas used consists of complex molecules such as methane, tetrafluoride, carbon, then they will rupture in the plasma state, forming free functional monomers that will bond and resurface on the polymer surface. The compound is coated on the surface of the polymer.
· This polymer surface coating significantly changes the permeability and friction of the surface.
1. Disinfection and sterilization:
· Plasma disinfection has received a lot of recognition for the sterilization of medical devices.
· Plasma treatment has great potential for simultaneous cleaning and disinfection of medical devices.
· Plasma sterilization is especially suitable for the cleaning of medical instruments or dental implants and equipment for high temperature, chemicals, irradiation, allergies.
2. Increased adhesion
· The surface energy of many biomaterials is very low, making it difficult to effectively adhere and coat.
· Plasma surface activation leads to the formation of surface functional groups that will enhance the surface energy of the biomaterial and improve the adhesion of the interface.
· Most untreated biomaterials have very weak wettability (hydrophilicity).
· Plasma surface treatment can increase or decrease the hydrophilicity of many different biological materials.
· The surface can be made hydrophilic by plasma activation, and the surface can be water-repellent by plasma coating.
4. Low friction and barrier layer
· Some materials have a high coefficient of friction on ester and polymer surfaces, such as polyurethane.
· The plasma coating has a small coefficient of friction that makes the surface of the biomaterial smoother.
· Plasma coatings also form a dense barrier to reduce the permeability of liquids or gases to biological materials.
Plasma plasma cleaner application:
● Surface activation/cleaning; ● Bonding after plasma treatment; ● Plasma etching/activation; ● Plasma degumming;
● Plasma coating (hydrophilic, hydrophobic); ● Enhanced bonding.
Surface cleaning, treatment and activation are actually achieved by active reactive particles in the gas stream. In addition to this, loose harmful particles on the treated surface will be removed by the reactive gas ions in the compressed air.
Suitable for processing the following materials: plastic, rubber, metal, glass, ceramic and hybrid materials.
The active gas stream exiting the plasma showerhead always maintains the release of HV energy. Equipment is commonly used in a variety of processes in the electronics industry, such as:
Remove harmful binders before bonding.
Clean the LCD touch screen and activate it before heat sealing.
The electronic device is activated before printing.
The front end of the mobile phone glass terminal is activated and activated.
Surface treatment with a plasma cleaner is a continuous process. The speed of the treatment (V) and the distance between the surface to be treated and the plasma nozzle (D) are two important factors that affect the surface treatment effect. Changing these two parameters will directly change the final processing result.