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      Shenzhen three and wave of Electrical and Mechanical Technology Co., Ltd

      400 0061 1152CN
      Atmospheric Pressure
      • PT-15S true plasma cleaning machine 15L

      PT-15S true plasma cleaning machine 15L

      Category:Atmospheric Pressure

      Introduction: PT-15S true plasma cleaning machine 15L

      Service Hotline:400 0061 1152

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      • Features
      • Application

      Category: Small vacuum plasma surface treatment machine

      Introduction: Plasma cleaning machine manufacturer-Shenzhen Sanhe Boda Electromechanical Technology Co., Ltd. Vacuum chamber stainless steel plasma cleaning machine Laboratory plasma cleaning machine Small square plasma cleaner Vacuum plasma cleaning device

      Model: PT-15S

      *Power supply: AC220V

      *Working current: The working current of the whole machine is not more than 1.2A (excluding vacuum pump)

      *RF power supply: 0-600W

      *RF frequency: 40KHZ or 13.56MHz optional (offset less than 0.2KHz)

      * Frequency offset: less than 0.2KHz

      * Characteristic impedance: 50 ohms, automatic matching

      * Vacuum degree: 30Pa-100Pa

      *Gas flow rate: 10-100ml/min (adjustable)

      * Process control: MCU automatic and manual mode

      Cleaning time: 1-99999 seconds adjustable

      Power size 10%-100% adjustable

      Inner cavity size 200mm × 150mm × 400mm

      *Dimensions: PT-15S type _650*520*500

      *Weight: 45Kg

      * Vacuum pump: 2XZ-4

      * Vacuum chamber temperature: less than 65 ° C

      *Cooling method: Forced wind


      [Plasma cleaning machine application and principle]


      First, the metal surface is degreased and cleaned

      Metal surfaces often have organic substances such as grease and oil, and oxide layers. Before sputtering, painting, bonding, bonding, welding, brazing, and PVD, CVD coating, plasma treatment is required to obtain complete cleanliness and no oxidation. The surface of the layer. Plasma treatment in this case produces the following effects:

      1.1 ashing the surface organic layer

      - the surface will be chemically bombarded (oxygen below)


      - Partial evaporation of contaminants under vacuum and transient high temperatures

      - Contaminants are crushed under the impact of high energy ions and carried out by vacuum

      - UV radiation destroys pollutants

      Because plasma processing can only penetrate a few nanometers per second, the contaminated layer should not be too thick. Fingerprints also apply.

      1.2 oxide removal

      Metal oxides react chemically with process gases (below)


      This treatment requires hydrogen or a mixture of hydrogen and argon. Sometimes a two-step process is also used. The first step is to oxidize the surface with oxygen for 5 minutes. In the second step, the oxide layer is removed with a mixture of hydrogen and argon. It can also be treated with several gases at the same time.

      1.3 welding

      Typically, printed wiring boards are treated with a chemical flux prior to soldering. These chemicals must be removed by plasma after the soldering is completed, otherwise it will cause corrosion and other problems.

      1.4 bond

      Good bonding is often impaired by plating, bonding, and residue during soldering operations, and these residues can be selectively removed by plasma methods. At the same time, the oxide layer is also detrimental to the quality of the bond and plasma cleaning is also required.

      Second, plasma etching

      During the plasma etching process, the etched material becomes a gas phase by the action of the processing gas (for example, when etching with silicon using fluorine gas, the following figure). The process gas and matrix material are pumped out by a vacuum pump and the surface is continuously covered by fresh process gas. It is not desirable to cover the etched portion with a material (for example, the semiconductor industry uses chromium as a covering material).


      The plasma method is also used to etch the surface of the plastic, and the mixture can be ashed by oxygen to obtain a distribution analysis. Etching methods are important as pretreatment means for plastic printing and bonding, such as POM, PPS and PTFE. Plasma treatment can greatly increase the bond wetted area.

      Third, etching and ashing

      PTFE etching

      PTFE cannot be printed or bonded without treatment. It is well known that the use of active alkaline metals enhances adhesion, but this method is not easy to grasp and the solution is toxic. Using a plasma method not only protects the environment, but also achieves better results. (The following figure)


      The plasma structure maximizes the surface while forming an active layer on the surface so that the plastic can be bonded and printed.


      Etching of PTFE mixture

      The etching of the PTFE mixture must be carried out very carefully to avoid excessive exposure of the filler, thereby weakening the adhesion.


      The process gases can be oxygen, hydrogen and argon. Can be applied to PE, PTFE, TPE, POM, ABS and propylene.

      4. Surface activation and cleaning of plastics, glass and ceramics

      Plastics, glass, and ceramics are as non-polar as polypropylene and PTFE, so these materials are processed before printing, bonding, and coating. At the same time, slight metal contamination of the glass and ceramic surfaces can also be cleaned by plasma. Plasma treatment does not damage the sample compared to the burning process. At the same time, the entire surface can be treated very evenly without toxic fumes, and hollow and slit samples can be processed.

      · No need to pretreat with solvent

      · All plastics can be applied

      · Environmentally meaningful

      · Take up very small work space

      ·           low cost

      The effect of the plasma surface treatment can be verified simply by using water, and the surface of the treated sample is completely wetted by water. For long periods of plasma treatment (greater than 15 minutes), the surface of the material is not only activated but also etched, and the etched surface has a wetting ability. Commonly used processing gases are: air, oxygen, argon, argon-hydrogen mixed gas, CF4, etc.

      Fifth, plasma coating



      In the coating, two gases enter the reaction chamber at the same time, and the gas is aggregated in a plasma environment. This application is more stringent than the requirements for activation and cleaning. Typical applications are the formation of protective layers for fuel containers, scratch-resistant surfaces, PTFE-like coatings, waterproof coatings, and the like. The coating is very thin, usually a few microns, where the affinity of the surface is very good. There are 3 cases commonly used

      · Waterproof coating - cycline

      · Coating similar to PTFE---fluorine-containing processing gas

      · Hydrophilic coating---ethylene acetate

      The small plasma cleaner has the advantages of low cost and flexible operation. Compared with large products with a price of more than US$100,000, the small plasma cleaning minicomputer has the following advantages:

      1. It can operate more flexibly and easily change the type of processing gas and processing procedure.

      2, will not cause any harm to the body of the person.

      3. Its cost is negligible for plasma processing methods.

      Small plasma equipment is widely used in plasma cleaning and surface modification. Through its treatment, it can improve the wetting ability of materials, enable a variety of materials to be coated, plated, etc., enhance adhesion, bonding force, and remove organic pollutants, oil or grease.

      Its specific applications include:

      1. Activation of plastic, glass and ceramic surfaces

      Glass, ceramics, and plastics (such as polypropylene, PTFE, etc.) are essentially non-polar, so these materials are surface activated prior to bonding, painting, and coating.

      2, metal degreasing and cleaning

      Metal surfaces often have organic substances such as grease and oil, and oxide layers. Before sputtering, painting, bonding, bonding, welding, brazing, and PVD, CVD coating, plasma treatment is required to obtain complete cleanliness and no oxidation. The surface of the layer.

      Before the welding operation: Usually the printed circuit board is treated with chemical flux before soldering. These chemicals must be removed by plasma after the soldering is completed, otherwise it will cause corrosion and other problems.

      Before the bonding operation: good bonding is often weakened by residues during plating, bonding, and soldering operations, and these residues can be selectively removed by a plasma method. At the same time, the oxide layer is also detrimental to the quality of the bond and plasma cleaning is also required.


      · Easy to operate and low cost

      · High efficiency vacuum electrode

      · Gas flow through the flow meter and needle valve for precise control

      · Power can be adjusted within 200W (completely able to meet cleaning needs, more than 200W for etching)

      · Automatic impedance matching

      · Free setting parameters: processing time, power, gas, pressure

      · Safety protection function: vacuum trigger, door lock


      [Plasma cleaner application]



      Plasma cleaning

      · Conventional cleaning methods do not completely remove the surface film of the material, leaving a very thin layer of impurities, and solvent cleaning is a typical example of this.

      · The use of a plasma cleaner is to scrub the surface gently and completely by bombardment of the surface of the material by plasma.

      ? Plasma cleaning will remove invisible oil film, tiny rust and other such contaminants formed on the surface due to user exposure to outdoor exposure, etc., and plasma cleaning will not leave a residue on the surface.

      · Plasma cleaners can handle a wide range of materials: plastics, metals, ceramics, and surfaces with varying geometries.

      · The advantage of the plasma cleaner is that it not only cleans the dirt on the surface, but also enhances the adhesion of the surface of the material.

      2. Polymer cleaning

      1 polymer surface cleaning

      · Plasma ablation mechanically removes the dirt layer by high-energy electrons and ions bombarding the surface of the material.

      · Plasma surface cleaning removes dirt layers that may be present in certain processed polymers, unwanted polymer surface coatings and weak boundary layers

      2 Surface reorganization of the polymer

      ? The inert gas used in plasma ablation destroys the chemical bonds on the polymer surface leading to the formation of free functional groups on the polymer surface.

      ? The free functional groups on the surface of the polymer re-bond to form the original polymer structure, also bond to free functional groups adjacent on the same polymer chain, or to free functional groups in the vicinity of different polymer chains.

      · Polymer surface reorganization can improve the hardness and chemical resistance of the surface.

      3 Surface modification of the polymer

      ? Plasma ablation destroys the chemical bonds on the polymer surface, resulting in the formation of free functional groups on the polymer surface.

      · Based on the chemistry of the plasma process gas, the attachment of these surface free functional groups to the atoms or chemical groups in the plasma forms a new polymer functional group that replaces the old surface polymer functional group.

      · Polymer surface modification can change the chemical properties of the material surface without changing the overall properties of the material.

      4 polymer surface coating

      · Plasma coating forms a thin plasma coating on the surface of the substrate by polymerization of the process gas.

      · If the process gas used consists of complex molecules such as methane, tetrafluoride, carbon, then they will rupture in the plasma state, forming free functional monomers that will bond and resurface on the polymer surface. The compound is coated on the surface of the polymer.

      · This polymer surface coating significantly changes the permeability and friction of the surface.

      3. Biomaterials

      1. Disinfection and sterilization:

      · Plasma disinfection has received a lot of recognition for the sterilization of medical devices.

      · Plasma treatment has great potential for simultaneous cleaning and disinfection of medical devices.

      · Plasma sterilization is especially suitable for the cleaning of medical instruments or dental implants and equipment for high temperature, chemicals, irradiation, allergies.

      2. Increased adhesion

      · The surface energy of many biomaterials is very low, making it difficult to effectively adhere and coat.

      · Plasma surface activation leads to the formation of surface functional groups that will enhance the surface energy of the biomaterial and improve the adhesion of the interface.

      3. Infiltration

      · Most untreated biomaterials have very weak wettability (hydrophilicity).

      · Plasma surface treatment can increase or decrease the hydrophilicity of many different biological materials.

      · The surface can be made hydrophilic by plasma activation, and the surface can be water-repellent by plasma coating.

      4. Low friction and barrier layer

      · Some materials have a high coefficient of friction on ester and polymer surfaces, such as polyurethane.

      · The plasma coating has a small coefficient of friction that makes the surface of the biomaterial smoother.

      · Plasma coatings also form a dense barrier to reduce the permeability of liquids or gases to biological materials

      Application field

      Low-temperature plasma surface treatment technology is carried out before many processes, and can achieve twice the result with half the effort. Among them, many processes are applied: bonding pretreatment, printing pretreatment, binding pretreatment, welding pretreatment, and package pretreatment. According to its own characteristics, it is applied to: cleaning dust, residual glue, oxides, carbon deposits, etc., which are invisible to the naked eye, so that the surface of the material is roughened, activated, and hydrophilic.


      Cleaning and solderability enhancement of Led brackets, wafers, ICs, etc.; enhanced bonding of electronic components, activation of PCBs and ceramic substrates, etc.

      Packaging industry

      The surface treatment before the adhesive of PET, PP, OPP, UV, carton or jam bottle greatly reduces the cost of glue.

      Printing industry

      Surface silk printing of metal, glass, rubber, plastic, composite materials, etc., and plasma treatment before printing can greatly improve the adhesion of the ink.
      Labeling, jam bottles, metal containers, and cable pre-treatment before cable fiber optics increase their binding.

      Automobile industry

      Lamp bonding, aluminizing, injection molding, pretreatment; brake pads, ignition coils, engine control covers, bumpers, etc. can be cleaned by plasma cleaning technology and
      Activate to make it more secure.
      Painting of body and parts, coating pretreatment, etc.

      Plastic industry

      The bonding pretreatment of plastic with rubber, metal, glass, etc., can greatly improve the surface activity after plasma cleaning.
      Pre-treatment of toys, mobile phone cases, computer cases, stationery cases, etc., can improve the adhesion of ink.

      other industry

      Cell phone, biology, aviation, military, medicine, equipment, electroplating, microelectronics, etc.

      Vacuum plasma cleaner:

      1. The cleaning object is dried after plasma cleaning and can be sent to the next process without drying. Can improve the processing efficiency of the entire process line;
      Second, the plasma cleaning allows the user to stay away from the harmful solvent to the human body, and also avoids the problem of easy cleaning and cleaning of the object in the wet cleaning; Third, avoid the use of ODS harmful solvents such as trichloroethane, so that it will not be produced after cleaning Harmful pollutants, so this cleaning method is an environmentally friendly green cleaning method. This is becoming more and more important when the world is highly concerned about environmental protection;
      4. The plasma generated by the high frequency of the radio wave range is different from the direct light such as the laser. The directionality of the plasma is not strong, which allows it to go deep into the micro-holes and recesses of the object to complete the cleaning task, so there is no need to think too much about the shape of the object being cleaned. Moreover, the cleaning effect on these difficult-to-clean parts is similar to or better than that of Freon cleaning;
      Fifth, the use of plasma cleaning can greatly improve the cleaning efficiency. The entire cleaning process can be completed in a few minutes, so it has a high yield;
      6. Plasma cleaning requires a controlled vacuum of approximately 100 Pa. This cleaning condition is easily achieved. Therefore, the equipment cost of such a device is not high, and the cleaning process does not require the use of a relatively expensive organic solvent, which makes the overall cost lower than the conventional wet cleaning process;
      Seventh, the use of plasma cleaning, to avoid the treatment of transportation, storage, discharge and other cleaning measures, so the production site is easy to maintain clean;
      Eight, plasma cleaning can be processed regardless of the object, it can handle a variety of materials, whether metal, semiconductor, oxide, or polymer materials (such as polypropylene, polyvinyl chloride, polytetrafluoroethylene, polyacyl) All polymers such as imines, polyesters, and epoxy resins can be treated using plasma. Therefore, it is especially suitable for materials that are not heat resistant and solvent resistant. Moreover, it is also possible to selectively clean the whole, partial or complex structure of the material;
      Nine, while cleaning and decontaminating, it can also improve the surface properties of the material itself. Such as improving the wetting properties of the surface, improving the adhesion of the film, etc., which is very important in many applications.

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